
Detailed Model Notes:

- The source in the Icepak models represents Trancas TTV.
- Icepak model does not include TIM2.
- To account for TIM2, use the following equation.
	Case-to-ambient resistance = case-to-ambient resistance from the model + 0.015 C/W.  
	TIM2 offset of 0.015 C/W is valid for Trancas TTV only
- Model predicts mean psi_ca values obtained in testing w/ ShinEtsu G751 (R) grease.
- Use TTV to CPU psi_ca correction offset to figure out heatsink performance on the processor. 
	TTV to CPU correction offsets are documented in TMDG and TTV Users' Guide.
- Under Solve --> Define Trials --> parameter $pwr shold be set to processor TDP.

Compact Model Notes

- The loss coefficients used in the compact models are calculated such that the model reproduces 
  pressure drop vs. CFM curve obtained in testing.
- Under Solve --> Define Trials --> parameter $pwr should be set to processor TDP. 
	This will change power dissipated in the fin region to TDP.
- Before incorporating compact model into system level model, delete all parameters. 
	Solve --> Define Trials --> make sure Design Variables tab is clicked --> Delete All Variables.
- In a system level model, represent fins as a flow resistance block.  
	Use loss cofficients values given in the compact model.
	Run system level model to determine how much flow goes through the fin region. 
  	Use case-to-ambient thermal resistance curve given in Thermal Design Guide to figure out case-to-ambient
  	thermal resistance for Intel reference solution in your system.
